High Temperature Press Pads - Precision Engineering for Extreme Heat

Bora’s High Temperature Press Pads (including BT and WGT series) are engineered to deliver superior performance in the most demanding PCB, FPC, and CCL lamination environments. Composed of specialized fluororubber and high-elastic fiberglass, these pads are designed to withstand temperatures up to 400°C while maintaining exceptional structural integrity.

Our press pads act as a critical interface in the lamination lay-up, optimizing both heat transfer and pressure distribution. This ensures uniform resin flow and prevents air bubbles, resulting in high-yield production of multi-layer boards and IC substrates. With a non-stick surface and high-density fiber structure, Bora’s pads offer a long service life (up to 800 cycles), significantly reducing your operational costs.

Key Features:

• Extreme Heat Resistance: Reliable performance in high-temperature pressing cycles up to 400°C.

• Optimal Pressure Distribution: Ensures uniform density and homogeneity across the entire panel.

• High Durability: Specialized fiber structure allows for 500-800 uses depending on press parameters.

• Non-Stick Surface: Engineered to prevent adhesion to press plates, ensuring clean and easy separation.