| Thickness： | 1.6mm |
| Size： | 18inch*24inch |
| Material： | Modified Silicone + High-Elastic Fiberglass |
| Max Temperature： | 230℃ |
| Application： | FPC, Rigid and Flex circuit board |
| Sheet or Roll： | Available in Sheets or Rolls |
Designed for flexible circuit manufacturing, this pad excels in filling gaps between dense patterns. Its high elasticity ensures "conformal" pressure, protecting delicate traces and coverlays during FPC lamination.
