10+ Years Heat Press Lamination Specialists

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Cushion Pads
  • 16-002.png - PCB Press Pad with thickness 1.6mm
  • 16-44=-28.png - PCB Press Pad with thickness 1.6mm
  • 16-2.png - PCB Press Pad with thickness 1.6mm
  • 16-7.png - PCB Press Pad with thickness 1.6mm
  • 16-002.png - PCB Press Pad with thickness 1.6mm
  • 16-44=-28.png - PCB Press Pad with thickness 1.6mm
  • 16-2.png - PCB Press Pad with thickness 1.6mm
  • 16-7.png - PCB Press Pad with thickness 1.6mm
Heat Press Lamination Pads
Thickness: 1.6mm
Size: 457mm*610mm
Material: Modified Silicone + High-Elastic Fiberglass
Max Temperature: 230℃
Application: FPC, Rigid and Flex circuit board
Sheet or Roll: Available in Sheets or Rolls
Consultation Hotline:
+8615817229201
Product Introduction

Product Description

The Bora WGT Series is a highly cost-effective and durable lamination solution specifically developed for the Flexible Printed Circuit (FPC) and New Energy industries. By combining high-purity modified silicone with reinforced fiberglass, it offers extreme resilience.


Technical Specifications

PropertyDetails
Product NameWGT Series Modified Silicone Cushion Pad
Material CompositionModified Silicone + High-Elastic Fiberglass
Thickness1.6mm (Customizable)
Size457mm*610mm (Customizable)
Max Operating Temp230℃ (Extreme Heat Resistance)
Service Life500 - 10000 Press Cycles (Depending on parameters)
FormatAvailable in Sheets or Rolls


Core Advantages & Features

  • Extreme Longevity: Exceptional durability that can reach up to 10,000 cycles, significantly lowering the total cost of ownership for high-volume production.

  • High Resilience & Recovery: The modified silicone structure maintains its cushioning properties and thickness even after repeated high-pressure cycles.

  • Thermal Uniformity: Ensures consistent heat transfer across the entire pressing surface, critical for flexible PI heating films and battery components.

  • Universal Compatibility: Engineered to perform seamlessly with all major global lamination press brands.

  • Customizable Configurations: Available in multiple thicknesses and sizes to meet specific FPC lamination requirements.


Specialized Applications

Bora WGT Pads are the preferred choice for high-precision lamination in:

  • FPC: Flexible printed circuit lamination requiring delicate pressure control.

  • New Energy:  Lamination for solar panels, EV battery heating films, and flexible PI circuits.

  • Consumer Electronics: Components requiring delicate but firm pressure control.



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Contact Us
Name:Anna
Phone:+8615817229201
Tel:+8615817229201
Email:[email protected]
Address:No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
Contact
+8615817229201
Phone:+8615817229201
Email:[email protected]
Address:No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
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Founded in 2016, Bora Lamination Materials Division is a global leader in high-performance cushion materials. We specialize in R&D ...
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