| Thickness： | 5mm |
| Size： | 450*550 |
| Material： | Fluororubber + High Elastic Fiberglass |
| Max Temperature： | 320℃ |
| Application： | CCL, PCB, FPC, New Energy products |
| Sheet or Roll： | Sheet |
IC Substrate Lamination Press Pad
Engineered for the ultra-fine precision of IC substrate manufacturing. These pads provide superior micro-Z-axis conformance and extreme thickness uniformity, ensuring perfect registration for microvias and ultra-fine line circuits (min. 25μm). Essential for high-density flip-chip and BGA packaging.
