
| Thickness: | 4.5mm |
| Size: | 450*550 |
| Material: | Fluororubber + High Elastic Fiberglass |
| Max Temperature: | 320℃ |
| Application: | CCL, PCB, FPC, New Energy products |
| Sheet or Roll: | Sheet |
The Bora BT Series Press Pad is a high-performance composite engineered from premium Fluororubber (FKM) and High-Elastic Fiberglass. Designed for extreme thermal environments, this cushion pad features a precision-smooth surface and a superior fiber structure that ensures high density and absolute homogeneity.
By optimizing both pressure distribution and thermal transfer within the press, the BT pad ensures a highly uniform resin flow, effectively preventing lamination defects in complex stack-ups.
| Property | Details |
| Product Name | BT Series High-Performance Press Pad |
| Material Composition | Premium Fluororubber + High-Elastic Fiberglass |
| Thickness | 4.5mm (Customizable) |
| Size | 450mm * 550mm (Customizable) |
| Max Operating Temp | 320℃ (Extreme Heat Resistance) |
| Service Life | 500 - 800 Press Cycles (Depending on parameters) |
| Format | Precision Cut Sheets |
Superior Thermal Stability: Rated for continuous use up to 320℃, making it ideal for high-Tg PCB and advanced CCL lamination.
Optimized Resin Flow: The high-density fiber structure eliminates pressure hot-spots, ensuring uniform resin distribution across the board.
Non-Stick Surface Technology: Specifically formulated to ensure no sticking to press plates, reducing downtime and protecting your tooling investment.
High Elasticity & Recovery: The combination of Fluororubber and high-elastic fiberglass provides excellent thickness recovery, maintaining performance over 500+ cycles.
Custom Thickness: Ranges from 1.0mm to 10.0mm to match your press requirements.
Universal Compatibility: Engineered for all major lamination press brands.
Process Optimization: Expert consulting to help you choose the right thickness for better yield.
Bora BT Pads are the preferred choice for high-precision lamination in:
CCL & PCB: Multilayer and high-frequency board production.
New Energy: Lamination for solar panels and EV battery components.
Advanced Electronics: IC Substrates and high-density interconnects (HDI).