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Cushion Pads
  • 16-1.png - PCB Press Pad with thickness 4.5mm
  • 16-15.png - PCB Press Pad with thickness 4.5mm
  • 16-2.png - PCB Press Pad with thickness 4.5mm
  • 16-7.png - PCB Press Pad with thickness 4.5mm
  • 16-1.png - PCB Press Pad with thickness 4.5mm
  • 16-15.png - PCB Press Pad with thickness 4.5mm
  • 16-2.png - PCB Press Pad with thickness 4.5mm
  • 16-7.png - PCB Press Pad with thickness 4.5mm
Thermal Management Buffer Pad
Thickness: 4.5mm
Size: 450*550
Material: Fluororubber + High Elastic Fiberglass
Max Temperature: 320℃
Application: CCL, PCB, FPC, New Energy products
Sheet or Roll: Sheet
Consultation Hotline:
+8615817229201
Product Introduction

Thermal Management Buffer Pad is specifically optimized for Metal Core PCBs (MCPCB) and New Energy EV battery boards, this pad manages high thermal loads during pressing to ensure perfect bonding of aluminum and copper substrates.

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Contact Us
Name:Anna
Phone:+8615817229201
Tel:+8615817229201
Email:[email protected]
Address:No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
Contact
+8615817229201
Phone:+8615817229201
Email:[email protected]
Address:No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
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