| Thickness： | 5mm |
| Size： | 650*720 |
| Material： | Fluororubber + High Elastic Fiberglass |
| Max Temperature： | 320℃ |
| Application： | HDI, IC Substrate, High-layer Count PCB |
| Sheet or Roll： | Sheet |
Description：
Engineered for high-layer count HDI and IC Substrate lamination. This series features a modified silicone structure with enhanced thermal conductivity, ensuring rapid heat transfer and uniform temperature distribution across the entire panel.
Key Features：
Thermal conductivity up to 1.2 W/m·K.
Reduces "Cold Spot" effects during fast-ramp heating.
Maintains thickness stability under 300°C+ environments.
Application： IC Substrate, High-speed Server Boards, Automotive PCBs.
