Product Description

The Bora TPX Release Film is a high-performance protection layer used primarily to prevent adhesive and resin overflow during the rapid pressing process. It is particularly effective at protecting solder pads and gold fingers from contamination.

Its unique physical properties allow it to conform tightly to the board surface, ensuring that no resin seeps into restricted areas while maintaining easy removal after the lamination cycle.

Core Advantages

● Adhesive Control: Effectively prevents resin flow onto gold fingers and solder pads.

● No Residue: Peels off cleanly without leaving any chemical or adhesive trace.

● High Precision: Maintains dimensional stability even under rapid heating and cooling cycles.

● Enhanced Aesthetics: Prevents imprinting and bubbling on the final board surface.

Specialized Applications

FPC Gold Fingers: Protection during flexible circuit pressing.

Semiconductor Testing Boards: Precision protection for high-value testing substrates.