| Thickness： | 4.5mm |
| Size： | 450*550 |
| Material： | Fluororubber + High Elastic Fiberglass |
| Max Temperature： | 320℃ |
| Application： | CCL, PCB, FPC, New Energy products |
| Sheet or Roll： | Sheet |
Tailored for High-Density Interconnect (HDI) technology, these pads offer ultra-fine pressure control to protect microvias. They ensure consistent resin flow and thickness, critical for high-speed signal integrity in 5G and mobile devices.
