As the telecommunications industry pivots from 5G to the early research stages of 6G, the materials used in PCB fabrication are undergoing a radical shift. High-frequency signal transmission requires low-loss dielectric materials such as PTFE (Teflon) and Liquid Crystal Polymer (LCP).

While these materials offer superior electrical performance, they are highly sensitive to thermal fluctuations during the press cycle. Excessive or uneven heat can cause internal stress, leading to "warpage" or the degradation of the material’s dielectric properties. Professional press rooms are now adopting High-Conductivity Composite Cushion Pads, which act as a thermal stabilizer. By facilitating a controlled and balanced heat rise, these pads allow manufacturers to preserve the delicate Dk/Df balance required for 6G infrastructure, ensuring that signal integrity remains uncompromised at terahertz frequencies.