The electric vehicle (EV) market is rapidly transitioning to 800V fast-charging architectures to reduce charging times and increase efficiency. This shift requires PCBs to carry much higher currents, leading to the use of heavy copper layers (up to 12oz or more).

Laminating these "heavyweight" boards is a technical minefield. The large gaps between thick copper traces must be perfectly filled with resin to prevent air entrapment or "starvation," which can lead to electrical arcing. Advanced lamination solutions now include high-conformity TPX films and reinforced press plates that apply targeted pressure to these uneven surfaces. These specialized materials ensure a bubble-free bond, providing the safety and reliability required for the high-power electronics that drive the modern EV revolution.