The global race for Artificial Intelligence dominance has triggered an unprecedented surge in the demand for AI data centers. At the heart of these facilities are ultra-high-layer count PCBs (often exceeding 20 to 40 layers) designed to handle massive computational loads.

Laminating such complex structures presents a formidable challenge: even a micron-level deviation in thickness or a slight misregistration can lead to catastrophic signal loss or impedance failure. To combat this, manufacturers are shifting away from traditional materials toward high-modulus carrier plates and precision-engineered cushion pads. These tools ensure that pressure is distributed with absolute uniformity across the entire panel, maintaining the structural integrity required for next-generation AI accelerators and server backplanes. As AI models grow in complexity, the "lamination precision" becomes the decisive factor in manufacturing yield.