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24
2026-01
The Surge of AI Servers: Redefining High-Layer PCB Lamination Standards
Infrastructure, Discover how the AI server boom is redefining high-layer PCB lamination standards and why precision pressure distribution is critical for 40-layer board yields.
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24
2026-01
Industry 4.0: Integrating RFID Traceability into the Lamination Cycle
Learn how integrating RFID traceability into the lamination cycle is revolutionizing quality assurance and data-driven manufacturing in smart PCB factories.
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24
2026-01
Navigating Thermal Stress in 6G Low-Loss Material Lamination
Learn how to navigate thermal stress in 6G low-loss material lamination to preserve Dk/Df properties for next-generation high-frequency telecommunications.
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24
2026-01
FOPLP: The Strategic Bridge Between Semiconductor and PCB Processes
Release Film, Explore the convergence of semiconductor and PCB processes through FOPLP and the requirement for micron-level flatness in advanced packaging lamination.
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24
2026-01
Sustainability in the Press Room: The Shift Away from Single-Use Kraft Paper
The shift away from single-use Kraft paper to reusable modified silicone pads is driving both sustainability and cost-efficiency in modern PCB press rooms.
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24
2026-01
The 800V Revolution: Challenges in Heavy Copper Lamination for EVs
Addressing the technical hurdles of heavy copper lamination for the 800V EV market and the specialized tools required to ensure bubble-free resin flow.
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24
2021-06
Rigid PCB Copper Clad Laminate
Copper Clad Laminate, also known as PCB laminate, is an indispensable substrate material in the manufacturing of printed circuit boards.
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24
2021-06
High-frequency Materials with Low Dielectric Constant
Copper Clad Laminate, also known as PCB laminate, is an indispensable substrate material in the manufacturing of printed circuit boards.
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24
2021-06
Copper Core Copper Clad Laminate Properties
Copper Clad Laminate, also known as PCB laminate, is an indispensable substrate material in the manufacturing of printed circuit boards.
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24
2021-06
Aluminum Core Copper Clad Laminate
Copper Clad Laminate, also known as PCB laminate, is an indispensable substrate material in the manufacturing of printed circuit boards.
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Name：Anna
Phone：+8615817229201
Tel：+8615817229201
Email：
[email protected]
Address：No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
About
Company Profile
Corporate culture
Business philosophy
Products
Cushion Pads
Release Films
Steel Plates
Tooling Plates
Application
CCL industry
FPC industry
PCB Industry
New Energy Industry
News
Company News
Industry news
Contact
+8615817229201
Phone：
+8615817229201
Email：
[email protected]
Address：No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
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Founded in 2016, Bora Lamination Materials Division is a global leader in high-performance cushion materials. We specialize in R&D ...
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