High-Conductivity Composite Cushion Pad

Bora’s High-Conductivity Composite Cushion Pads are designed for heavy-copper PCBs and thick multilayer backplanes that demand rapid, uniform thermal profiles. By integrating high-thermal-conductivity fillers into a resilient elastomer matrix, this pad reduces the temperature gradient across the press area, eliminating hot spots and preventing board warping. Its superior structural integrity maintains precise parallelism even under extreme pressure, ensuring consistent dielectric thickness for high-power industrial and automotive electronics.