| Thickness： | 3.0mm |
| Size： | 457mm*610mm |
| Material： | Fluororubber + High Elastic Fiberglass |
| Max Temperature： | 320℃ |
| Application： | CCL, Mutilayer PCB |
| Sheet or Roll： | Sheet |
Low-Loss High-Frequency Lamination Pad
Optimized for 5G, 6G, and automotive radar applications. This cushion pad minimizes thermal stress during the lamination of low-Dk/Df materials (like PTFE or LCP). It facilitates a controlled, steady heat rise to prevent signal distortion and maintain the structural integrity of high-frequency signal layers.
