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24
2026-01
Sustainability in the Press Room: The Shift Away from Single-Use Kraft Paper
The shift away from single-use Kraft paper to reusable modified silicone pads is driving both sustainability and cost-efficiency in modern PCB press rooms.
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24
2026-01
The 800V Revolution: Challenges in Heavy Copper Lamination for EVs
Addressing the technical hurdles of heavy copper lamination for the 800V EV market and the specialized tools required to ensure bubble-free resin flow.
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24
2021-06
Rigid PCB Copper Clad Laminate
Copper Clad Laminate, also known as PCB laminate, is an indispensable substrate material in the manufacturing of printed circuit boards.
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24
2021-06
High-frequency Materials with Low Dielectric Constant
Copper Clad Laminate, also known as PCB laminate, is an indispensable substrate material in the manufacturing of printed circuit boards.
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24
2021-06
Copper Core Copper Clad Laminate Properties
Copper Clad Laminate, also known as PCB laminate, is an indispensable substrate material in the manufacturing of printed circuit boards.
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24
2021-06
Aluminum Core Copper Clad Laminate
Copper Clad Laminate, also known as PCB laminate, is an indispensable substrate material in the manufacturing of printed circuit boards.
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24
2019-06
Flexible Copper Clad Laminate
Flexible Copper Clad Laminate (FCCL) is a specially designed type of Copper Clad Laminate that is commonly used in manufacturing flexible PCBs. It is created by laminating a layer of copper foil to a flexible core material, such as polyimid···
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05
2026-03
How Does Release Film Effectively Prevent Resin Overflow During Lamination?
Stop resin overflow and contamination in your PCB press cycles. Discover how high-quality release films use surface energy and thermal stability to lock resin in place.
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05
2026-03
How to Choose the Right Press Pad Thickness for Your PCB Production?
Optimize your PCB lamination process by choosing the right press pad thickness. Learn how thickness affects pressure uniformity, thermal conductivity, and HDI board quality.
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26
2026-01
High-Performance PCB Lamination Materials & Solutions
Global leader in PCB lamination materials. BORA offers premium press pads and release films to ensure high-quality lamination for PCB, CCL, and FPC industries.
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Name:Anna
Phone:+8615817229201
Tel:+8615817229201
Email:
[email protected]
Address:No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
About
Company Profile
Corporate culture
Business philosophy
Products
Cushion Pads
Release Films
Steel Plates
Tooling Plates
Application
CCL industry
FPC industry
PCB Industry
New Energy Industry
News
Company News
Industry news
Contact
+8615817229201
Phone:
+8615817229201
Email:
[email protected]
Address:No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
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Founded in 2016, Bora Lamination Materials Division is a global leader in high-performance cushion materials. We specialize in R&D ...
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