FPC Lamination Accessories – Optimized for Flexible Circuit Manufacturing

Bora provides precision-engineered lamination press materials tailored for FPC (Flexible Printed Circuit) production. Due to the thin, delicate nature of flexible substrates, FPC lamination demands highly stable and evenly distributed pressure, accurate stack-up, and clean separation.

Our FPC Lamination Products:

⭐️ Cushion Pad for FPC LaminationFlexible, high-temperature-resistant material that cushions the substrate during pressing, absorbs pressure variation, and prevents wrinkling or delamination of the FPC layers.

⭐️ Separator PlateSmooth, flat stainless steel or aluminum plates offer uniform pressure and heat transfer across the FPC stack, ensuring dimensional accuracy and surface smoothness.

⭐️ Tooling PlateCustomized for FPC press configurations, these plates ensure alignment of delicate layers, reducing press misregistration and increasing production yield.

⭐️ Release FilmDesigned to prevent resin overflow and contamination, our heat-resistant release film ensures clean separation and protects both boards and press plates. 

Why Our Accessories Are Ideal for FPC Production:High flexibility and thermal resistance

💡 Pressure absorption for fragile substrates

💡 Improved product yield, fewer lamination defects

💡 Compatible with hot press cycles used in FPC & HDI lines 

🌍 Serving the Global FPC Industry

We support manufacturers of mobile device PCBs, camera modules, flex-rigid boards, and wearable electronics, offering consistent lamination performance and material reliability.

📩 Need Expert Lamination Accessories for Your FPC Line?

We’re here to help with technical support and fast response.

📧 Email: [email protected] 📞 WhatsApp / Phone: +8615817229201