Product Description

The Bora 3-in-1 Conformal Film is a specialized composite material designed specifically for boards with significant surface topography and height variations. It features a sophisticated three-layer structure with a composite polymer center that flows precisely into gaps during the press cycle.

This film eliminates air bubbles and "resin starvation" areas, ensuring a flat, defect-free finish for high-end electronic substrates where precision is non-negotiable.

Core Advantages

● Superior Gap Filling: The polymer center flows into every contour, ensuring absolute coverage of surface height differences.

● Integrated Release: No need for additional release films, streamlining the lamination lay-up process.

● Bubble Elimination: Specifically engineered to prevent vacuum voids and air entrapment in complex circuits.

● Yield Improvement: Directly reduces scrap rates for Rigid-Flex and high-layer-count boards.

Specialized Applications

Rigid-Flex PCB: The gold standard for boards with varying thicknesses.

High-Density Interconnects (HDI): Perfect for fine-line and micro-via filling requirements.