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12
2020-03

Empowering Industry 4.0: Bora Series Single-Cushion Materials Streamline Lamination Productivity

Optimize your lamination workflow with Bora Series single-cushion materials. Designed to automate processes, improve efficiency, and maximize heat press productivity.

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22
2026-01

2026 Lunar New Year Holiday & Shipping Schedule

Please be informed that BORA will be closed for the 2026 Chinese New Year holiday from February 14th to February 22th, 2026. Plan your orders in advance for WGT & BT series to ensure timely delivery.

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24
2026-01

The Surge of AI Servers: Redefining High-Layer PCB Lamination Standards

Infrastructure, Discover how the AI server boom is redefining high-layer PCB lamination standards and why precision pressure distribution is critical for 40-layer board yields.

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24
2026-01

Industry 4.0: Integrating RFID Traceability into the Lamination Cycle

Learn how integrating RFID traceability into the lamination cycle is revolutionizing quality assurance and data-driven manufacturing in smart PCB factories.

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21
2020-01

Bora Unveils BT Cushion Pad: A Breakthrough in PCB and CCL Lamination Technology

Bora BT Cushion Pad is a revolutionary material designed for PCB and CCL lamination, providing superior cushioning for defect-free, high-precision electronics manufacturing.

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22
2020-01

Bora Launches Revolutionary WGT Cushion Pad to Elevate FPC Lamination Precision

Discover Bora's new WGT Cushion Pad. A revolutionary solution for FPC lamination, providing superior cushioning and ensuring defect-free high-precision electronics manufacturing.

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22
2019-01

Bora Expands Product Range with Standard Silicone Press Pads for Versatile Lamination Needs

Reliable and cost-effective Red and Green Silicone Press Pads from Bora. Proven solutions for standard PCB, CCL, and FPC lamination processes.

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24
2026-01

Navigating Thermal Stress in 6G Low-Loss Material Lamination

Learn how to navigate thermal stress in 6G low-loss material lamination to preserve Dk/Df properties for next-generation high-frequency telecommunications.

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24
2026-01

FOPLP: The Strategic Bridge Between Semiconductor and PCB Processes

Release Film, Explore the convergence of semiconductor and PCB processes through FOPLP and the requirement for micron-level flatness in advanced packaging lamination.

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24
2026-01

Sustainability in the Press Room: The Shift Away from Single-Use Kraft Paper

The shift away from single-use Kraft paper to reusable modified silicone pads is driving both sustainability and cost-efficiency in modern PCB press rooms.

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+8615817229201

Phone：+8615817229201
Email：[email protected]
Address：No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China

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