| Thickness： | 10mm |
| Size： | 800mm*1000mm |
| Material： | Hardox450 |
| Max Temperature： | 400℃ |
| Application： | FPC, Rigid and Flex circuit board, CCL, PCB and Aluminum Base Board |
| Sheet or Roll： | Set |
Panel Level Packaging (PLP) Carrier Tray
Designed for the next generation of semiconductor packaging, our PLP Carrier Trays offer extreme dimensional stability and micron-level flatness. These carriers support the rapid growth of Fan-out Panel Level Packaging (FOPLP), providing a robust platform for high-density component placement and vacuum-assisted lamination processes.
