10+ Years Heat Press Lamination Specialists

+8615817229201

PCB Press Pad WeChat QR Code
Release Films
  • 16-8.png - PCB Press Pad with thickness 250um
  • 16-20.png - PCB Press Pad with thickness 250um
  • 16-2.png - PCB Press Pad with thickness 250um
  • 16-6.png - PCB Press Pad with thickness 250um
  • 16-8.png - PCB Press Pad with thickness 250um
  • 16-20.png - PCB Press Pad with thickness 250um
  • 16-2.png - PCB Press Pad with thickness 250um
  • 16-6.png - PCB Press Pad with thickness 250um
Semiconductor Grade Release Film
Thickness: 250um
Size: 750mm*620mm
Material: PET+PE
Max Temperature: 190℃
Application: Rigid and Flex circuit board, CCL, Mutilayer PCB
Sheet or Roll: Sheet
Consultation Hotline:
+8615817229201
Product Introduction

Semiconductor Grade Release Film

Designed for ultra-clean environments, our Semiconductor Grade Release Films offer extremely low outgassing and zero particulate contamination. These films are critical for Fan-out Wafer Level Packaging (FOWLP) and IC substrate lamination, where any microscopic residue can lead to catastrophic device failure.

Get a Free Sample Online
Contact Us
Name:Anna
Phone:+8615817229201
Tel:+8615817229201
Email:[email protected]
Address:No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
Contact
+8615817229201
Phone:+8615817229201
Email:[email protected]
Address:No. 199, Xinsha Road, Baoan District, Shenzhen City 518125, Guangdong Province, China
Follow Us
Founded in 2016, Bora Lamination Materials Division is a global leader in high-performance cushion materials. We specialize in R&D ...
Copyright © 2016 - 2026 Bora Lamination Materials Division. All Rights Reserved.Trusted by the Global PCB, CCL & FPC Industry for High-Performance Cushion Solutions. Site Map