| Thickness： | 25um |
| Size： | 1360mm*1000m |
| Material： | PET |
| Max Temperature： | 190℃ |
| Application： | FPC, Rigid and Flex circuit board, CCL, PCB and Aluminum Base Board |
| Sheet or Roll： | Sheet and Roll both OK |
Description：
Specially designed for FPC and Rigid-Flex lamination. The BORA-AW series features a proprietary heat-stabilized base with ultra-low thermal shrinkage, ensuring a perfectly flat surface even under rapid temperature changes.
Key Features：
Thickness: 12μm - 25μm for high-density stack-ups.
Thermal Shrinkage: <0.1 at 200℃ (30 min).
Anti-static coating to prevent dust adsorption.
